• Perform feasibility studies for flip chip and wirebond BGA substrate designs. Perform substrate design and develop custom substrate/module in flip chip and wire-bond ball grid array packages
• Work closely with both silicon design engineers and PCB layout designers to conduct feasibility studies and define flip chip bump patterns, wire-bond pad rings, as well as package ballout that achieve performance requirement with the lowest system total cost solution
• Ensure package design follow SI constrains for cross-talk, IR drop, and noise in device. Ensure package solution meet device thermal performance requirement
• Generate substrate design and assembly instruction document for manufacturing
• IC packaging technology development and qualification
• Interface with substrate and packaging vendors to identify and to resolve quality issues. Interface with substrate and packaging vendors to implement cost reduction and quality improvement plans
Job Requirements :  • Typically requires a BS degree and 12 years of experience, an MS degree and 9 years of experience or a PhD and 6 years of experience with IC package design and reliability tests
• Experienced with Cadence APD/APE, Avanti...

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